Global Semiconductor Assembly And Testing Services Market is expected to Exhibit a CAGR of 5.6% during the forecast period (2023 - 2030), Owing to Increasing Demand for Mobility and Connectivity in Consumer Electronic Products
According to the global semiconductor assembly and testing services market report, the market is segmented By Service (Assembly & Packaging Services and Testing Services), By Packaging Solutions (Copper Wire and Gold Wire Bonding, Copper Clip, Flip Chip, Wafer Level Packaging, and TSV), By Application (Communication, Computing & Networking, Consumer Electronics, and Industrial and Automotive Electronics) and By Region (North America, Europe, Asia Pacific, Latin America, and Middle East and Africa).
The term "assembly and testing" refers to any or all of the procedures and actions typically carried out on a lithographically completed semiconductor wafer to create an integrated circuit that is fully packaged and tested, including but not limited to making contacts on the wafer surface, packaging, chip probe testing, slicing or removing semiconductor dice from the wafer, depositing solder bumps, mounting the dice in protective cases, and attaching wires to the dice that pass through holes.
Global Semiconductor Assembly And Testing Services Market - Drivers
Additional features offered by SATS providers over in-house testing and packaging capabilities
SATS providers have extended capabilities by offering additional features, namely miniaturization, additional functionality, low power consumption, and improved thermal and electrical performance. This helps OSTAS providers a gain competitive advantage over Integrated Design Manufacturers (IDM) in-house testing capabilities. Moreover, an increase in the semiconductor content within electronic products is expected to provide better functionality and higher levels of performance. Hence, these factors are expected to support the global semiconductor assembly and testing services market growth in the near future.
Global Semiconductor Assembly And Testing Services Market - Restraints
High capital investment for high-end packaging solutions
High-end semiconductor packaging and testing businesses require high capital investments to produce expensive equipment manufactured by a limited number of suppliers. Increasing demand for miniaturization and low thermal ratings have mandated the adoption of advanced packaging solutions. However, as the capital required for offering these solutions is high, only a few players are able to provide these services, thereby restraining market growth.
Key Takeaways
The global semiconductor assembly and testing services market is estimated at US$ 33.42 Billion in 2023 and is projected to reach US$ 48.81 Billion by 2030, exhibiting a CAGR of 5.6% over the forecast period (2023-2030).
Global Semiconductor Assembly And Testing Services Market - Key Developments
In July 2022, Jiangsu Changjiang Electronics Tech Corp., semiconductor company launched 4-nanometer chip packaging for cell phones and the integrated central processing unit, graphics processing unit, and radio frequency chipset packaging.
In June 2022, MediaTek, in association with Taiwan Semiconductor Manufacturing Company, for the upcoming system-on-chip for 8K digital TV equipped with potent artificial intelligence, versatile video coding-decoding, and picture-in-picture technology.
Global Semiconductor Assembly And Testing Services Market - Impact of COVID-19
In numerous businesses, the COVID-19 epidemic has caused a stir. Governments around the world have been compelled to place stringent restrictions on vehicles and people moving around because of the virus's unparalleled rise in transmission. The demand for electronic components from the industrial sector and end users decreased, which had a severe negative impact on the semiconductor industry. Microelectronics' revenue model has changed because no mass production was done during the shutdown. China is one of the most important manufacturing centers in the area and places a stronger emphasis on industry. Lockdowns following the COVID-19 epidemic in numerous APAC nations have slowed the expansion of the manufacturing sector.
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Key Trends and Analysis of the Global Semiconductor Assembly And Testing Services Market:
- Among region, Asia Pacific accounted for the largest market share in the global semiconductor assembly and testing services market. Increasing demand for mobility and connectivity in consumer electronic products is expected to drive regional market growth.
- North America is expected to witness significant growth over the forecast period. Advancements in technology in automotive electronics in next-generation cars that are installed with high-end electronic components to improve the car’s performance have significantly increased the demand for semiconductor packaging and testing services in the region. The rising adoption of advanced electronics in sophisticated engine and safety controls, especially in hybrid electric cars, is expected to boost market growth in the near future.
- Major players operating in the global semiconductor assembly and testing services market include ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies Inc.), STATS chipPAC Ltd. (JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.
