Market News
Global Wafer Inspection Equipment Market: Key Developments
- In December 2018, ISRA VISION, a manufacturer of solutions in the machine vision and industrial image processing launched edgeScan wafer edge inspection system that allows wafer edges to be monitored during the entire manufacturing process, both increasing yield and lowering costs.
- In July 2018, KLA-Tencor, provider of process control and yield management solutions has announced two new defect inspection products Voyager 1015 and Surfscan SP7, addressing two key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the leading-edge logic and memory nodes.
- In May 2018, Meyer Burger Technology Ltd has launched its WIS-08 wafer inspection system at SNEC, Shanghai China. The WIS-08 wafer inspection system is used by the photovoltaic industry to test silicon wafers and to classify them according to quality.
- In January 2018, Hitachi High-Technologies Develops Wafer Surface Inspection System LS9300A-EG.It is designed for inspection of wafer surfaces prior to circuit patterning application and is capable of inspecting both the front and backsides of wafers.
- In September 2015, Lasertec has launched SICA88 SIC wafer inspection and review systems. According to the company, this system is featured both surface and photoluminescence (PL) inspection capabilities, SICA88 enables customers to concurrently inspect and analyses surface defects as well as crystallographic defects.