Global Ultrasonic Sensors Market: Key Developments
In January 2021, Qualcomm Technologies, Inc., a semiconductor company, had launched Qualcomm 2nd generation 3 Sonic Sensor, which larger than Gen 1 by 77% due to which it can provide larger area for users to place their finger for capturing 1.7x more biometric data.
In December 2020, Murata Manufacturing Co. Ltd., manufacturer of electronic components, had opened its Minato MIRAI Innovation Center and became the latest research and development hub of Kanto, Japan.
In August 2020, Murata Manufacturing Co. Ltd., manufacturer of electronic components, had developed its novel production facility. With this building, the company will be building a system that enables the company to respond to long-and medium-term increase in ceramic parts demand, as the sophistication of electronic devices as well as use of electronics in automobiles is increasing.
In January 2020, Honeywell International, a multinational conglomerate corporation, had entered into collaboration with Verizon, a telecommunications company. The collaboration was done for simplification and accelerating the deployment of novel communication-enabled, intelligent sensors and controls for the smart electric grid.
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