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THERMOFORM PACKAGING MARKET ANALYSIS

Thermoform Packaging Market - Global Industry Insights, Trends, Outlook, and Opportunity Analysis, 2022-2028

  • To Be Published : Nov 2024
  • Code : CMI780
  • Formats :
      Excel and PDF
  • Industry : Packaging

Market Challenges And Opportunities

Restraints:

New thermoforming technique called as ‘Computational Thermoforming’ has come up as an alternative to 3D printing. It was developed by Zurich-based Interactive Geometry Lab in 2016. This largely cuts down time required for manufacturing special purpose packaging. Adoption of this technology is expected to restrain growth of the market over the forecast period. 

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