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Rising Complexity of Edge ApplicationsAdvancements in artificial intelligence, 5G networks, augmented reality, autonomous vehicles and other frontier technologies boosts demand for specialized high-performance chips. Production of AI inference chips, network processors, self-driving SoCs and other application-specific ICs requires dedicated semiconductor manufacturing processes. Setting up these specialized fabs from scratch demands substantial investment in tailored semiconductor machinery and equipment.
Even general purpose computing and mobile device chips are growing multilayered with integration of different components like CPU, GPU, NPU, modem, and otherson the same die. Manufacturing such system-on-chips with multiple lithography steps and 3D interconnects needs equipment customized for each function and interface. Edge applications relying on IoT and mobile also demand lower power chips suitable for miniaturized form factors. This changes the needs for semiconductor equipment to focus more on supporting 3D shapes, new materials, and integrating different devices seamlessly.
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