SEMICONDUCTOR ASSEMBLY AND TESTING SERVICES MARKET ANALYSIS
Recent Developments:
In May 2021, Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new (Adaptive Patterning Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE), semiconductor assembling and test manufacturing services and Siemens Digital Industries Software.
In October 2020, ASE, provider of semiconductor manufacturing services, Ministry of Education (MOE), and National Kaohsiung University of Science and Technology (NKUST) together established an onsite campus semiconductor assembly and test facility to develop world-class high-tech industry graduates.
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