NEXT GENERATION PACKAGING MARKET ANALYSIS

Market News

Global Next Generation Packaging Market- Recent Development

In April 2020, DuPont, launched new Tyvek 40L in China, plans for availability worldwide For the launch of DuPont Tyvek 40L medical packaging, a new class of Tyvek for medical packaging applications that offers a practical solution for safeguarding portable, low-risk equipment, we thank DuPont Protection Solutions.

In May 2022, Microchip Technology Inc., has unveiled the GridTime 3000 GNSS time server, a software-configurable system that protects power plants and substations from surges, bad weather, and cyber-attacks targeting critical infrastructure.

In May 2022, Analog Devices, Inc., has unveiled a three-axis MEMS accelerometer that may be used in a variety of healthcare and industrial applications, such as vital sign monitoring, hearing aids, and motion-enabled metering devices. The ADXL367 accelerometer reduces power consumption by two times compared to the previous generation (ADXL362) while boosting noise performance by up to 30%. The new accelerometer also has a longer field duration, which extends battery life while lowering maintenance frequency and costs.

In May 2022, Qualcomm Technologies, Inc. and Viettel Group announced plans to collaborate on the development of a next-generation 5G Radio Unit (RU) with enormous MIMO capabilities and distributed units (DUs). This is aimed at accelerating the development and deployment of 5G network infrastructure and services in Vietnam and around the world. Viettel expects to accelerate the development and commercialization of high-performance Open RAN massive MIMO solutions, which simplify network deployment and lower total cost of ownership, by combining the Qualcomm® X100 5G RAN Accelerator Card and Massive MIMO Qualcomm® QRU100 5G RAN Platform with its own advanced hardware and software systems (TCO).