NEXT GENERATION MEMORY TECHNOLOGIES MARKET ANALYSIS

Next Generation Memory Technologies Market, By Technology (Non-volatile (Magneto-Resistive Random-Access Memory (MRAM), Ferroelectric RAM (FRAM), Resistive Random-Access Memory (ReRAM), 3D Xpoint, Nano RAM, and Other Non-volatile Technologies (Phase change RAM, STT-RAM, and SRAM)), and Volatile ((Hybrid Memory Cube (HMC), High-bandwidth Memory (HBM)), By Industry Vertical (BFSI, Consumer Electronics, Government, Telecommunications, Information Technology, and Other Industries), By Geography (North America, Latin America, Asia Pacific, Europe, Middle East, and Africa)

In April 2023, SK Hynix Inc. became the first in the industry to develop a 12-layer HBM3 product with a 24-gigabyte (GB) memory capacity, currently the largest in the industry. This 24 GB package product increases memory capacity by 50% from the previous generation, following the mass production of the world’s first HBM3 in June 2022.
In May 2022, Everspin Technologies Inc., a semiconductor company, (U.S.) launched STT-MRAM EMxxLX xSPI Family, offering densities ranging from 8 Mbit to 64 Mbit
In March 2022, Fujitsu a Semiconductor Memory Solution provider, (Japan) introduced a 12Mbit ReRAM (Resistive Random Access Memory), MB85AS12MT, the largest density in Fujitsu’s ReRAM product family. The MB85AS12MT is a non-volatile memory with 12Mbit density and operates across a wide range of power supply voltages from 1.6V to 3.6V.