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MEMORY PACKAGING MARKET ANALYSIS

Memory Packaging Market, By Platform (Flip-chip, Lead-frame, Wafer-level Chip-scale Packaging (WLCSP), Through-Silicon Via (TSV), Wire-bond), By Application (NAND Flash Packaging, NOR Flash Packaging, DRAM Packaging, Other Applications), By End User (IT and Telecom, Consumer Electronics, Embedded Systems, Automotive, Other End Users), and By Geography (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa)

  • Published In : Apr 2023
  • Code : CMI5667
  • Pages :142
  • Formats :
      Excel and PDF
  • Industry : Packaging

Regional Analysis

Global Memory packaging Market: Regional Insights

Based on geography, the global memory packaging market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.

North America is expected to dominate the global memory packaging market over the forecast period owing to the strong growth of consumer electronics sector in the US. According to the consumer electronics association, the consumer electronics industry in the United States is estimated to grow by 3.9% in size from 2018 to 2019, reaching a total of US$ 398 billion in retail revenue

Asia Pacific is expected to witness fastest growth in the global market over the forecast period as it is home to some of the leading manufacturing hubs and thriving technology companies. The region also has a strong base of suppliers, foundries, and end users of advanced semiconductor packaging products. According to SEMI, China may top the rest of the world in fab investment, by 2020, with more than US$ 20 billion in spending, driven by memory and foundry projects, funded by both multinational and domestic companies. Currently, 25 new fab construction projects are planned in China. About 17 - 300 mm fabs are being tracked as part of this investment and expansion activity. This is anticipated to impact the memory packaging market’s growth positively, over the forecast period.

Figure 1. Global Memory packaging Market, By Region 2022

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