Memory Packaging MarketSize and Trends

The global memory packaging market size was valued at US$ 26.95 billion in 2022 and is anticipated to witness a compound annual growth rate (CAGR) of 7.31% from 2023 to 2030. The memory packaging market is a rapidly growing on the account of increasing demand for memory chips in mobile devices and other applications such as telematics, data centers, automotive, and consumer electronics. The market also getting benefit from a number of technological advancements that are being made in the field of electronic circuitry.

Global Memory packaging Market: Key Developments

In October 2022, TSMC announced the Open Innovation Platform® (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric™ Alliance is TSMC’s sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness, with a full spectrum of best-in-class solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging.

Global Memory packaging Market Trends:

Miniaturization of semiconductor device is a recent trend

Miniaturization is a key trend in electronic device fabrication that is enabling new technological devices to be built, from portable computers and smartphone technology to smart medical devices. The key process of semiconductor miniaturization is called exposure, which involves using precision optical instrument to transfer a circuit pattern of elements and interconnections to a wafer.

Advent of artificial intelligence (AI)-based mobile applications and 5G technology

The launch of artificial intelligence (AI)-based mobile applications and 5G technology is projected to growth worldwide with a high volume of investments from the respective companies. As the above-mentioned technologies evolve, the need for power and energy reduction in mobile devices will drastically increase. This will create demand for exceptional DRAM which in turn augment the growth of the market.

Global Memory packaging Market Segmentation:

The global memory packaging market report is segmented into platform, application, end user, and region

Based on platform, the market is segmented into Flip-chip, Lead-frame, Wafer-level Chip-scale Packaging (WLCSP), Through-Silicon Via (TSV), and Wire-bond. Out of which, Flip-chip is expected to dominate the global market over the forecast period and this is attributed to its low power cost and high-density packaging. It has potential to replace traditional packaging technology.

Wafer-level Chip-scale Packaging segment is also expected to witness significant growth in the near future. WLSCP is the most commonly employed packaging for NOR flash and niche memory devices, such as EPROMs/EPROM/ROM. It is actively used in non-memory chips, such as application processors and power management integrated circuits (PMICs), to reduce the thickness of the package, which can improve heat dissipation.

Based on application, the market is segmented into NAND Flash Packaging, NOR Flash Packaging, DRAM Packaging, and Other Applications. Out of which, NAND Flash Packaging is expected to dominate the global market over the forecast period. Flash memory is a key component in mobile devices such as smartphones and tablets, with the average smartphone containing 43GB of NAND storage.

NOR Flash Packaging segment is also expected to witness significant growth in the near future. NOR flash is an embedded memory device that supports random-access read and write operations. This feature is a boon for complex embedded devices that rely on fast code execution

Based on end user, the market is segmented into IT and Telecom, Consumer Electronics, Embedded Systems, Automotive, and Other End Users. Out of which, IT and Telecom is expected to dominate the global market over the forecast period and this is attributed to the rapid adoption of 5G technology and innovation in wireless communication.

Consumer Electronics segment is also expected to witness significant growth in the near future owing to the increasing usage of smartphone, laptops, tablets, and other electronic devices. According to We are Social’s Digital in 2018, the unique mobile users was 5.135 billion.

Figure 2. Global Memory packaging Market, By Platform 2022