Name: Memory Packaging MarketChallenges and Opportunities
Creator: Coherent Market Insights
License: https://www.coherentmarketinsights.com/privacy-policy
Keywords: Memory Packaging Market, Memory Packaging Market Size, Memory Packaging Market Outlook, Memory Packaging Market Key Trends, Memory Packaging Market Competitors Analysis, Memory Packaging Market opportunity Analysis, Memory Packaging Market Shares, Memory Packaging Market Forecast, Industry Analysis, Business Insights, Intelligence

Memory Packaging Market, By Platform (Flip-chip, Lead-frame, Wafer-level Chip-scale Packaging (WLCSP), Through-Silicon Via (TSV), Wire-bond), By Application (NAND Flash Packaging, NOR Flash Packaging, DRAM Packaging, Other Applications), By End User (IT and Telecom, Consumer Electronics, Embedded Systems, Automotive, Other End Users), and By Geography (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa)

Published In : Apr 2023

Code : CMI5667

Pages :142

Formats :

Excel and PDF

Industry : Packaging

Market Challenges And Opportunities

Global Memory packaging Market Drivers:

Growing demand for data center driven by cloud and HPC application to foster market growth

Increased adoption of DRAM in the data center is expected to positively impact the market growth. According to the Coherent Market Insights analysis, by 2020, it is anticipated that the major global data centers would begin more than ten construction projects worldwide, of which, more than 80% are expected to be initiated by the North America data center market, which is expected to boost the demand for server DRAM. Moreover, in response to the new data center construction projects carried out by Google, Amazon Web Service, Facebook, and Microsoft Azure, Intel and AMD have introduced new server processors in 2018. Hence, growing demand for date center is expected to drive market growth.

Rising demand for smartphone and changing technology is augmenting market growth

The memory packaging is gaining high adoption in manufacturing of smartphone due to recent advancement in silicon wafer that have enabled the process of wafer level packaging (WLP), where IC is packaged while it is a component of the wafer. For example, the case of Apple’s iPhones, the 2007 version of iPhone involved just two wafer level packaging. By the time of the third iteration of iPhones (iPhone 5), the device consisted of seven wafer level packages in the device.

Global Memory packaging Market Restraints:

Challenges landscape of the OSAT industry to restrict market growth

The memory packaging is associated with integrated device manufacturers (IDMs) and the outsourced semiconductor assembly and test company (OSATS). The trade tensions between the China and United States have already led to some packaging houses to slow their funds in China. This factor is expected to hinder the market growth. However, memory packaging market continues to gain momentum, especially with the approaches, such as 3D, 2.5D, fan-out and system-in-package (SIP).

Limited capacity and higher power consumption of memory packaging to hinder market growth

The disadvantages of memory packaging include limited capacity, higher power consumption, and increased thickness limit. Such limitations are expected to hamper the adoption of technology thereby hindering market growth.