MEMORY PACKAGING MARKET ANALYSIS

Leading Companies

Global Memory packaging Market: Key Companies Insights

The global memory packaging market is highly competitive. This is attributed to continuous launch of new technologies due to ongoing R &D and efforts by value chain participants. Moreover, key players are adopting various business growth strategies in order to expand their presence on regional as well as global basis. Some of the key players in the global memory packaging market are Tianshui Huatian Technology Co Ltd, Hana Micron Inc., lingsen precision industries Ltd, Formosa Advanced Technologies Co. Ltd (FATC), Advanced Semiconductor Engineering Inc. (ASE Inc.), Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd, Powertech Technology, King Yuan Electronics Corp. Ltd, ChipMOS Technologies Inc., TongFu Microelectronics Co., and Signetics Corporation

Global Memory packaging Market Opportunities:

Growing popularity of TSV type memory packaging to present lucrative market opportunities. TSV is a highly efficient packaging method that uses a single layer of silicon to hold memory chips. This type of packaging is currently used in many memory chips, and it is expected to remain the dominant type for the foreseeable future. It is used in memory chips requiring high bandwidth and low latency for high performance computing applications.