LOAD PORT MODULE MARKET ANALYSIS

Market Concentration and Competitive Landscape

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In addition to the shift to 300mm wafer production internally by IDMs, the business model of outsourcing chip manufacturing to specialized foundries utilizing their 300mm fabrication infrastructure has gained significant traction over the years. Foundries such as TSMC and GlobalFoundries have made massive capital investments to establish leading-edge 300mm wafer fabrication facilities. An exponentially growing number of fabless semiconductor companies as well as IDMs outsourcing portions of their manufacturing are leveraging these foundry partners' 300mm services. This outsourcing trend allows chip design firms to focus on their core competencies while accessing some of the most advanced process technologies without having to bear the high fixed costs of setting up their own 300mm fabs.

In order to meet the rapid turnaround times and high volume manufacturing requirements of their clientele, foundries need to ensure wafer lots can smoothly traverse through the various production line steps with minimal logjams or disruptions.

For Instance, In September 2023, Tower Semiconductor and Intel Foundry Services (IFS) revealed a partnership where Intel will offer foundry services and 300mm manufacturing capability to help Tower serve its customers worldwide. Tower will utilize Intel's advanced manufacturing facilities in New Mexico as part of this agreement.