Moreover, conventional RF devices face many problems related to designing of single-chip transceivers, active, and passive devices on an IC. Owing to such challenges, electronic device manufacturers are focusing on design, simulation, and layout of wireless-communication RFIC chips. Moreover, the manufacturers are using on-chip components over off-chip components by modifying the architecture of IC and RFIC, which will propel demand for IC and RFIC designing services, as it will help to solve the issues related to integration of transceiver components on to a chip and to fulfill the rising demand for communication devices.
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