EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY MARKET ANALYSIS

Extreme Ultraviolet (EUV) Lithography Market Size and Trends

Global extreme ultraviolet (EUV) lithography market is estimated to be valued at US$ 9.42 Bn in 2024 and is expected to reach US$ 28.76 Bn by 2031, exhibiting a compound annual growth rate (CAGR) of 17.3% from 2024 to 2031.

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The Global Extreme Ultraviolet (EUV) Lithography Market is experiencing significant growth due to growing demand for integrated circuits with improved resolution and increasing applications of EUV lithography in the semiconductor industry. There will be huge demand for EUV lithography due to ongoing trend of device miniaturization. Manufacturers are increasingly adopting EUV lithography technology as it enables production of microchips with smaller features compared to traditional lithography methods. The need for higher resolution patterning compel semiconductor companies to deploy EUV lithography solutions.

Market Driver - Increasing Demand for Advanced Semiconductor Devices

Powerful smartphones, computers and other electronic devices require more sophisticated and compact chips in order to add new features, capabilities and deliver high performance. Semiconductor devices have become integral part of one’s daily lives and presence of chips in many of new household products can boost demand for Extreme Ultraviolet (EUV) Lithography. Devices such as smartphones have witnessed rise in adoption of faster processors and higher memory chips which support imaging, gaming and multimedia capabilities. Emergence of technologies such as AI, machine learning and 5G networks will add exponentially to data processing requirements of new devices.

Semiconductor manufacturers are under constant pressure to further miniaturize components and integrate more transistors into a single chip to meet performance and power goals. This compel them to adopt more advanced lithography techniques that can print finer patterns compared to conventional alternatives. While existing optical lithography technologies have nearly reached their capability limits, EUV lithography presents the most viable solution to enable further device scaling below 7nm node. It allows creating finer lines and spaces which is crucial for next generation logic and memory chips. 

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Growing Complexity of Integrated Circuits Requiring Advanced Lithography Techniques

There has been an unrelenting march towards integrating more transistors within the same silicon real estate to deliver enhanced functionality, affordability and efficiency of electronic systems. Semiconductor industry has continually encountered challenges related to device miniaturization as components size shrinks with each successive technology generation. Integrated circuits used to power new and emerging technologies like AI, IoT, autonomous vehicles require incredibly higher performance at much lower power levels. This growing complexity of chip designs exerts immense pressure on chipmakers to integrate billions of transistors on a single die, a requirement that existing lithography tools struggle to fulfil.

Developing chips for applications like data centres, supercomputers and edge servers pose even stiffer density demands. Achieving higher circuit density while maintaining process control and reliability require lithography techniques with much greater resolution, depth of focus and wafer throughput. While multi-patterning techniques were serving this purpose till date, these involve expensive multiple exposure steps thus limiting productivity. EUV lithography emerges as the most promising solution capable of precisely printing ever tinier features with a single exposure. It allows chip architects to place and interconnect record number of transistors on a die, thus, overcoming density bottlenecks. Leading foundries have been collaborating with lithography vendors to accelerate EUVL adoption in high volume manufacturing to meet the diverse performance needs of next gen systems. Relentless pursuit of achieving tera-scale integration levels can boost adoption of advanced lithography capabilities like EUV.

For instance, in January 2024, ZEISS Group, a leading provider of optical systems and semiconductor manufacturing technology, unveiled its High-NA (Numerical Aperture) Extreme Ultraviolet (EUV) lithography system. This advanced system marks a significant advancement in semiconductor manufacturing, enabling the production of microchips with exceptionally fine features, surpassing the capabilities of existing EUV systems. The High-NA-EUV technology will facilitate the creation of more powerful, energy-efficient, and cost-effective chips, setting the stage for the next generation of integrated circuits.