DIAMOND WIRE WAFER SLICING MACHINE MARKET ANALYSIS

Regional Analysis

Global Diamond Wire Wafer Slicing Machine Market: Regional Insights

The market for diamond wire wafer slicing machine in Asia Pacific accounted for largest share in the global market in 2017. The factor attributed to growth of the market is increasing penetration of smartphones, increasing adoption of IoT, self-driving cars, and others. Therefore, rising demand for consumer electronics is leading to high demand for diamond wire wafer slicing machines. For instance, according to the Coherent Market Insights’ analysis, the number of smartphone users in India was 292.6 million in 2016 and it has grown to 342 million in 2017. Increasing demand for smartphones and advancement in smartphone technology has led to development of thinner and smaller ICs. This leads to high demand for diamond wire wafer slicing machine. Hence, this factor will help in propelling growth of the market during the forecasted period.

Moreover, presence of key manufacturers such as Samsung, Sony, LG, Toshiba, Panasonic, Toyota, and Honda makes this region largest consumer of semiconductor ICs, which is another major driving factor leading to high demand for diamond wire wafer slicing machine for cutting wafer. Hence, this factor also helps in fuelling growth of the diamond wire wafer slicing machine in this particular region.