DIAMOND WIRE WAFER SLICING MACHINE MARKET ANALYSIS
Global Diamond Wire Wafer Slicing Machine Market: Key Trends
Increasing use of large size of wafer is a key trend that is being witnessed in the market. For instance, according to a press release of SEMI, a leading semiconductor manufacturing company, in 2014, Samsung, Intel, and IBM, among others were previously using 300mm diameter wafers, are now switching to 450mm diameter wafer. As the size of wafer increases, it will further increase the number of dies cut from it, which in turn helps in reduction of production cost as well as product wastage while slicing process. Therefore, as the size of wafer increase, it need more efficient machine to provide accurate cuts, and produce more dies from a single wafer.
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