DIAMOND WIRE WAFER SLICING MACHINE MARKET ANALYSIS
Global Diamond Wire Wafer Slicing Machine Market: Competitive Landscape
Major players operating in the global diamond wire wafer slicing machine market are Dalian Linton NC Machine Co., Ltd, Meyer Burger Technology AG, Slicing Tech,, Diamond Wire Technology, Disco Corporation, Plasma Therm LLC, Tokyo Electron Ltd, ATV Technologies, and EV Group among others.
Key players in the market are focusing on adopting product development strategy, in order to gain competitive edge in the market. For instance, in September 2014, Dalian Linton NC machine co., LTD. launched its new product QPJ1660B diamond wire wafer slicing machine. The production by using this system is clean as it based on water cutting fluid technology, which reduces environmental pollution caused by waste fluid.
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