5G CHIPSET MARKET ANALYSIS

Key Developments

• In November 2023, MediaTek, a Taiwan-based fabless semiconductor company renowned for its innovative chip solutions, launched Dimensity 8300 5G chipset, which incorporates generative AI capabilities. Built on TSMC's second-generation 4nm process, the chipset features an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores based on Arm's v9 architecture, paired with the Mali-G615 MC6 GPU. The Dimensity 8300 is designed to enhance the premium smartphone segment, offering users advanced in-hand AI features, hyper-realistic entertainment experiences, and seamless connectivity.
• In November 2023, Viettel High Tech, the research and development arm of the Vietnamese telecommunications giant Viettel, unveiled its own 5G chipset. This advanced 5G DFE (digital front end) chip is capable of performing an impressive 1 quadrillion calculations per second, marking a significant milestone in the company's efforts to establish a self-sufficient 5G infrastructure in Vietnam.
• In September 2023, Qualcomm, a leading designer of modem chips for mobile devices, announced an extension of its partnership with Apple to supply 5G chips for iPhones until at least 2026. This three-year deal, worth billions of dollars to Qualcomm, will provide stability to Apple's supply chain operations globally as the tech giant navigates increased challenges in the Chinese market and delays in launching its own 5G modem technology.
• In July 2023, Intel, a leading semiconductor manufacturer, announced a strategic partnership with Ericsson, a prominent telecommunications company, to produce custom 5G system-on-chips (SoCs) for Ericsson's telecom networking equipment. Utilizing Intel's advanced "18A" process technology, this collaboration marks a significant milestone in their ongoing efforts to develop next-generation optimized 5G infrastructure. The partnership aims to enhance Ericsson's capabilities in delivering efficient and resilient 5G solutions.
• In May 2023, MediaTek, a leading Taiwanese fabless semiconductor company, unveiled its new Dimensity 9200+ 5G chipset designed for premium smartphones. This advanced chipset, based on TSMC's second-generation 4nm process, features an octa-core architecture that includes one ultra-core Arm Cortex-X3 processor clocked at up to 3.35GHz, three Arm Cortex-A715 super-cores running at up to 3.0GHz, and four Arm Cortex-A510 efficiency cores operating at 2.0GHz, paired with the Arm Immortalis-G715 GPU. Smartphones powered by the MediaTek Dimensity 9200+ are expected to be available starting in May 2023, promising enhanced performance and efficiency for high-end mobile devices.

*Definition: The Global 5G Chipset Market refers to the market for semiconductor chips and chipsets that enable 5G network connectivity in devices such as 5G smartphones, hotspot devices, connected homes etc. 5G chipsets work with 5G network infrastructure to deliver network speeds many times faster than existing 4G LTE networks as well as provide higher bandwidth and low latency capabilities. Key players in the Global 5G Chipset Market provide 5G system on chips (SoCs), radio frequency integrated circuits (RFICs), millimeter wave integrated circuits (MMwave ICs), and others.