3D ICS MARKET ANALYSIS

3D ICs Market, By End-Use Sectors (Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others (Biomedical applications and R&D)), by Substrate Type (Silicon on insulator(SOI), Bulk silicon), by Fabrication Process ( Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization), by Product (MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED) and by Region (North America, Europe, Asia Pacific, RoW) - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027

Published In : Jun 2024
Code : CMI3941
Pages :140
Formats :
Excel and PDF
Industry : Semiconductors

Key Developments

In September 2023, TSMC's 2023 OIP Ecosystems Forum announced the new 3Dblox 2.0 open standard and highlighted the major achievements of its 3D fabric alliance open innovation platform.
In November 2023, Samsung Electronics is preparing to launch its advanced 3D chip packaging technology, SAINT, in an effort to challenge Taiwan Semiconductor Manufacturing Company's (TSMC) market dominance.
In March 2022, Amkor Technology, a company headquartered in South Korea, joined the TSMC Open Innovation Platform (OIP) 3D Fabric alliance. Through this partnership, Amkor will gain initial access to TSMC's 3D Fabric technology, enabling the alliance's partners to develop their products in parallel with TSMC. This collaboration will also allow the partners to offer a reliable supply of high-quality 2.5D and 3D integrated circuits (ICs).
In October 2021, Cadence Design Systems, Inc. announced the release of its Integrity 3D-IC platform, which is the first comprehensive 3D ICs platform available on the market. This platform integrates system analysis, design planning, and high-capacity 3D implementation into a single, unified cockpit.
In May 2021, Intel announced plans to invest USD 3.5 billion in upgrading its Rio Rancho facility, one of its three main US manufacturing hubs, which will support more than 35% of its local workforce. The company is expanding its New Mexico facilities to produce new generations of chips utilizing its Foveros 3D packaging technology, aiming to bolster its position as a market leader in the semiconductor industry.