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Increased adoption in other high growth verticals
While 3D ICs technology was initially utilized primarily in consumer electronics, its use is spreading to other verticals experiencing fast growth such as automotive, industrial equipment, and healthcare that require highly integrated and customized solutions. Autonomous and electric vehicles need sophisticated processing power and sensory capabilities to support functions such as computer vision, navigation, connected features and predictive maintenance. 3D stacking allows integrating different sensors, memory, control, and processing systems in the limited space available. Industrial equipment makers are exploring 3D designs to fulfill requirements for analytics-ready modular products. Medical devices would benefit from the technology's ability to integrate various lab-on-chip and microfluidic operations that empower applications like organ-on-chip models and point-of-care diagnostics. Governments and organizations worldwide are focusing on initiatives that support the research and development of customized 3D integrated solutions for strategic sectors. This expands the addressable market for 3D ICs beyond consumer devices and is driving greater attention and investments towards the technology from both private companies as well as public institutions.
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