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3D ICS MARKET ANALYSIS

3D ICs Market, By End-Use Sectors (Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others (Biomedical applications and R&D)), by Substrate Type (Silicon on insulator(SOI), Bulk silicon), by Fabrication Process ( Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization), by Product (MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED) and by Region (North America, Europe, Asia Pacific, RoW) - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027

  • Published In : Jun 2024
  • Code : CMI3941
  • Pages :140
  • Formats :
      Excel and PDF
  • Industry : Semiconductors

Market Concentration and Competitive Landscape

3D ICs Market Concentration By Players

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Key Players Insights
  • Amkor Technology
  • ASE Group
  • BeSang Inc.
  • IBM Corporation
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Micron Technology Inc.
  • MonolithIC 3D ICs Inc.
  • Samsung Electronics Co. Ltd.
  • STATS ChipPAC Ltd.
  • STMicroelectronics N.V.
  • Taiwan Semiconductor Manufacturing Company
  • Tezzaron Semiconductor
  • Toshiba Corporation
  • United Microelectronics Corporation
  • Xilinx Inc.

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