Table of Content - 3d Ics Market

The global 3D ICs market is witnessing robust growth with the rising demand for more compact and high-performance electronic devices. 3D ICs, also known as three-dimensional integrated circuits, refers to the vertical assembly of two or more IC chips stacked and connected vertically via through-silicon vias (TSVs) to reduce wire length and improve the signal propagation speeds. It enables device miniaturization by integrating more components in a small footprint. 3D ICs technology helps maximize chip density by stacking silicon dies and integrating them into one package which helps reduce the chip cost. It allows the placement of different components such as memory, graphics, processors, and radio electronics in one module. The higher bandwidth and low power consumption features associated with 3D ICs are fueling their demand for various applications across consumer electronics, medical devices, and automotive industries.

Market Dynamics:

The global 3D ICs market is driven by the increasing demand for high performance portable consumer electronics. The demand for devices with improved functionality in a compact form factor is propelling the need for 3D ICs. However, the high manufacturing cost associated with 3D ICs fabrication poses a challenge for widespread adoption. The complexity in the design and manufacturing process increases production costs. Opportunities lies in the emerging applications of 3D ICs in autonomous vehicles, augmented and virtual reality devices. The integration of logic chips, memory, and sensor components using 3D ICs technology can help enable advanced driver assistance, navigation, and infotainment services in vehicles. 3D ICs supports higher bandwidth and low-power consumption which will drive their adoption in battery-operated devices with graphics and processing-intensive requirements. efforts to lower manufacturing costs through new materials and design techniques will further help address barriers.

Key Features of the Study:

This report provides in-depth analysis of the global 3D ICs market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2024–2031), considering 2023 as the base year
It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
It profiles key players in the global 3D ICs market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies
Key companies covered as a part of this study include Amkor Technology, ASE Group, BeSang Inc., IBM Corporation, Intel Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Micron Technology Inc., MonolithIC 3D ICs Inc., Samsung Electronics Co. Ltd., STATS ChipPAC Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company, Tezzaron Semiconductor, Toshiba Corporation, United Microelectronics Corporation, and Xilinx Inc.
Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
The global 3D ICs market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global 3D ICs market

Detailed Segmentation:

By Product Type
- LED
- Memories
- MEMS
- Sensor
- Logic
- Others
By Substrate Type
- Silicon on Insulator (SOI)
- Bulk Silicon
By Application
- Information and Communication Technology
- Military
- Consumer Electronics
- Others
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East
- Africa
Key Players Insights
- Amkor Technology
- ASE Group
- BeSang Inc.
- IBM Corporation
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Micron Technology Inc.
- MonolithIC 3D ICs Inc.
- Samsung Electronics Co. Ltd.
- STATS ChipPAC Ltd.
- STMicroelectronics N.V.
- Taiwan Semiconductor Manufacturing Company
- Tezzaron Semiconductor
- Toshiba Corporation
- United Microelectronics Corporation
- Xilinx Inc.

Table of Contents

Research Objectives and Assumptions
- Research Objectives
- Assumptions
- Abbreviations
Market Purview
- Report Description
  - Market Definition and Scope
- Executive Summary
  - Market Snippet, By End-Use Sectors
  - Market Snippet, By Substrate Type
  - Market Snippet, By Fabrication Process
  - Market Snippet, By Process
  - Market Snippet, By Region
- Coherent Opportunity Map (COM)
Market Dynamics, Regulations, and Trends Analysis
- Market Dynamics
  - Drivers
  - Restraints
  - Market Opportunities
- Regulatory Scenario
- Industry Trend
- Merger and Acquisitions
- New System Launch/Approval
Impact of COVID-19 Pandemic on 3D ICs Market
- Short Term and Long Term Impact, By Region
  - North America
  - Europe
  - Asia Pacific
  - Latin America
  - Middle East and Africa
Global 3D ICs Market, By End- Use Sectors, 2017-2027 (US$ Billion)
- Introduction
  - Market Share Analysis, 2019 and 2027 (%)
  - Segment Trends
- Consumer electronics
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Information and communication technology
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Transport (automotive and aerospace)
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Military
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Others (Biomedical applications and R&D)
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
Global 3D ICs Market, By Substrate Type, 2017-2027 (US$ Billion)
- Introduction
  - Market Share Analysis, 2019 and 2027 (%)
  - Segment Trends
- Silicon on insulator (SOI)
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Bulk silicon
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
Global 3D ICs Market, By Fabrication Process, 2017-2027 (US$ Billion)
- Introduction
  - Market Share Analysis, 2019 and 2027 (%)
  - Segment Trends
- Beam re-crystallization
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Wafer bonding
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Silicon epitaxial growth
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Solid phase crystallization
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
Global 3D ICs Market, By Process, 2017-2027 (US$ Billion)
- Introduction
  - Market Share Analysis, 2019 and 2027 (%)
  - Segment Trends
- MEMS and Sensor
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- RF SiP
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Optoelectronics and imaging
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Memories (3D Stacks)
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- Logic (3D Sip/Soc)
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
- HB LED
  - Introduction
  - Market Size and Forecast, 2020–2027, (US$ Billion)
Global 3D ICs Market, By Region, 2017-2027 (US$ Billion)
- Introduction
  - Market Share Analysis, By Region, 2019 and 2027 (%)
- North America
  - Regional Trends
  - Market Size and Forecast, By End-Use Sectors, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Substrate Type, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Fabrication Process, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Process, 2020–2027 (US$ Billion)
  - Market Share Analysis, By Country, 2019 and 2027 (%)
    - U.S.
    - Canada
- Europe
  - Regional Trends
  - Market Size and Forecast, By End-Use Sectors, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Substrate Type, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Fabrication Process, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Process, 2020–2027 (US$ Billion)
  - Market Share Analysis, By Country, 2019 and 2027 (%)
    - U.K.
    - Germany
    - Italy
    - France
    - Russia
    - Rest of Europe
- Asia Pacific
  - Regional Trends
  - Regional Trends
  - Market Size and Forecast, By End-Use Sectors, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Substrate Type, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Fabrication Process, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Process, 2020–2027 (US$ Billion)
  - Market Share Analysis, By Country, 2019 and 2027 (%)
    - India
    - Japan
    - ASEAN
    - Australia
    - South Korea
    - Rest of Asia Pacific
- Latin America
  - Regional Trends
  - Market Size and Forecast, By End-Use Sectors, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Substrate Type, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Fabrication Process, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Process, 2020–2027 (US$ Billion)
  - Market Share Analysis, By Country, 2019 and 2027 (%)
    - Brazil
    - Argentina
    - Mexico
    - Rest of Latin America
- Middle East and Africa
  - Regional Trends
  - Market Size and Forecast, By End-Use Sectors, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Substrate Type, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Fabrication Process, 2020–2027 (US$ Billion)
  - Market Size and Forecast, By Process, 2020–2027 (US$ Billion)
  - Market Share Analysis, By Country, 2019 and 2027 (%)
    - GCC Countries
    - South Africa
    - Rest of the Middle East and Africa
Competitive Landscape
- Company Profiles
  - Taiwan Semiconductor Manufacturing Company, Ltd
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
  - MonolithIC 3D Inc.
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
  - XILINX, Inc.
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
  - Elpida Memory, Inc.
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
  - (Micron Technology, Inc.)
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
  - The 3M Company,
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
  - Ziptronix, Inc.
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
  - STATS ChipPAC Ltd.
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
  - United Microelectronics Corporation
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
  - Tezzaron Semiconductor Corporation
    - Company Overview
    - Product Portfolio
    - Financial Performance
    - Key Strategies
    - Recent Developments/Updates
Section
- References
- Research Methodology
- About Us and Sales Contact

*Browse 32 market data tables and 28 figures on “Global 3D ICs Market-forecast to 2031”.

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