Thermal Interface Materials (TIMs) are inserted between heat-generating devices like integrated circuits and heat sinks to enhance the transfer of heat from these devices to the exterior of a closed system. Without TIMs, air trapped between these devices inhibits the effective transfer of heat away from hot spots to the outer surface of the closed system. TIMs are available in a variety of formats including pads, pastes, gels, tapes and solders. They are generally designed to be soft, thermally conductive and electrically isolating to fill interface areas between surfaces, and they aid in heat removal from both sides of the interface.

Market Dynamics:

The market for thermal interface materials is expanding rapidly due to the increasing demand from various industries, such as electric vehicles, automotive electronics, aerospace, and consumer electronics. Moreover, rising demand from 5G technology-based digital devices is anticipated to propel the market growth. In addition, the global electronic industry is developing power and heat-efficient digital devices. This is expected to provide a lucrative growth opportunity for manufacturers in the thermal interface materials market.

On the other hand, fluctuating price of oil is expected to hamper the market growth.

Key features of the study:

• This report provides in-depth analysis of the global thermal interface materials market, and provides market size (US$ Million) and compound annual growth rate (CAGR%) for the forecast period (2023–2030), considering 2022 as the base year
• It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
• This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends,  regional outlook, and competitive strategies adopted by key players
• It profiles key players in the global thermal interface materials market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies
• Key companies covered as a part of this study include The 3M Company, Dow Corning Corporation, Honeywell International, Inc., Indium Corporation, Henkel AG & Co, KGaA, Parker Chomerics, Laird Technologies, Inc., Momentive Performance Materials, Inc., Fuji Polymer Industries, Co. Ltd., and Shin-Etsu Chemical Co. Ltd.
• Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
• The global thermal interface materials market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
• Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global thermal interface materials market

Detailed Segmentation:

• Global Thermal Interface Materials Market, By Product
  • Tapes & Films
  • Elastomeric Pads
  • Greases & Adhesives
  • Phase Change Materials
  • Metal
  • Others
• Global Thermal Interface Materials Market, By Application
  • Telecom
  • Computers
  • Medical Devices
  • Industrial Machinery
  • Consumer Durables
  • Automotive Electronics
  • Others
• Global Thermal Interface Materials Market, By Region
  • North America
  • Europe
  • Latin America
  • Asia Pacific
  • Middle East & Africa
• Company Profiles
  • The 3M Company
  • Dow Corning Corporation
  • Honeywell International, Inc.
  • Indium Corporation
  • Henkel AG & Co, KGaA
  • Parker Chomerics
  • Laird Technologies, Inc.
  • Momentive Performance Materials, Inc.
  • Fuji Polymer Industries, Co. Ltd.
  • Shin-Etsu Chemical Co. Ltd.