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Semiconductor Equipment Market, By Product Type (Semiconductor Front-end Equipment and Semiconductor Back-end Equipment), By Application (Discrete Semiconductor, Optoelectronic Device, Sensors, Integrated Circuits), By Equipment (Wafer Processing, Assembly & Packaging, Testing Equipment), By End-use Industry (PCs, Mobile Handsets, Televisions Assembly & Packaging), By Geography (North America, Latin America, Europe, Asia Pacific, Middle East & Africa)

  • Published In : Apr 2024
  • Code : CMI2532
  • Pages :188
  • Formats :
      Excel and PDF
  • Industry : Semiconductors
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Global semiconductor equipment market is estimated to be valued at US$ 96.17 Bn in 2024 and is expected to reach US$ 179.63 B by 2031, exhibiting a compound annual growth rate (CAGR) of 9.3% from 2024 to 2031.

Report Description:

Global semiconductor equipment market has been witnessing significant growth over the past few years due to Advancements in artificial intelligence, 5G networks, augmented reality, autonomous vehicles. Semiconductor equipment refers to the machinery used for manufacturing of semiconductors such as integrated circuits (ICs) and microchips. These include etching equipment, deposition equipment, cleaning equipment, and ion implantation equipment, among others.

With rapid technological advancements across industries such as consumer electronics, automotive, industrial automation and increasing demand for smart technologies, the demand for semiconductors is growing exponentially. This boosts the need for advanced semiconductor equipment for large scale manufacturing of semiconductors. Increasing investments by key players as well as governments towards developing domestic semiconductor ecosystem is expected to boost the semiconductor equipment market growth during the forecast period.

Global Semiconductor Equipment Market- Dynamics

The key drivers propelling the semiconductor equipment market include growing demand for consumer electronics such as smartphones, laptops and tablets coupled with increasing adoption of IoT and connected devices across industries. Furthermore, rising need for automation across manufacturing and other sectors has boosted demand for semiconductor ICs, and this boostssemiconductor equipment procurement.

However, high initial investments required for procurement and maintenance of semiconductor equipment remains a key challenge for emerging players as well as small and medium enterprises in this space. Volatile commodity prices and geopolitical risks add to supply chain uncertainties for semiconductor equipment manufacturers.

Increasing focus towards development of 5G infrastructure and deployment of 5G networks worldwide presents lucrative growth opportunities. Moreover, expansion of fabless chip design capabilities globally and growing outsourcing of chip manufacturing are anticipated to boost market opportunities for semiconductor equipment suppliers.

Key features of the study:

  • This report provides in-depth analysis of the global semiconductor equipment market, and provides market size (US$ Bn) and compound annual growth rate (CAGR%) for the forecast period (2024–2031), considering 2023 as the base year.
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market.
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players.
  • It profiles key players in the global semiconductor equipment market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies.
  • Key companies covered as a part of this study include Applied Materials Inc., ASML, Nordson Corporation, Cohu, Inc., Lam Research Corporation, Tokyo Electron Limited, KLA-Tencor Corporation, Teradyne Inc., ASM International N.V., Nikon. Corporation, Canon Inc., BE Semiconductor Industries N.V. (Besi), Veeco Instruments Inc., Rudolph Technologies, Inc., Onto Innovation Inc., Ultratech, Inc., Nova Measuring Instruments Ltd., Mycronic AB, SPTS Technologies Ltd.
  • Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics.
  • Global semiconductor equipment market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global semiconductor equipment market.

Detailed Segmentation-

  • By Product Type
    • Semiconductor Front-end Equipment
    • Semiconductor Back-end Equipment
  • By Application
    • Discrete Semiconductor
    • Optoelectronic Device
    • Sensors
    • Integrated Circuits
  • By Equipment
    • Wafer Processing
    • Assembly & Packaging
    • Testing Equipment
  • By End-use Industry
    • PCs
    • Mobile Handsets
    • Televisions Assembly & Packaging
  • By Regional
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East
    • Africa
  • Key Players Insights
    • Applied Materials Inc.
    • ASML
    • Nordson Corporation
    • Cohu, Inc.
    • Lam Research Corporation
    • Tokyo Electron Limited
    • KLA-Tencor Corporation
    • Teradyne Inc.
    • ASM International N.V.
    • Nikon Corporation
    • Canon Inc.
    • BE Semiconductor Industries N.V. (Besi)
    • Veeco Instruments Inc.
    • Rudolph Technologies, Inc.
    • Onto Innovation Inc.
    • Ultratech, Inc.
    • Nova Measuring Instruments Ltd.
    • Mycronic AB
    • SPTS Technologies Ltd.

Detailed Segmentation-

  • By Product Type
    • Semiconductor Front-end Equipment
    • Semiconductor Back-end Equipment
  • By Application
    • Discrete Semiconductor
    • Optoelectronic Device
    • Sensors
    • Integrated Circuits
  • By Equipment
    • Wafer Processing
    • Assembly & Packaging
    • Testing Equipment
  • By End-use Industry
    • PCs
    • Mobile Handsets
    • Televisions Assembly & Packaging
  • By Regional
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East
    • Africa
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