The Physical Vapor Deposition Market is estimated to be valued at USD 24.04 Bn in 2024 and, growing at a compound annual growth rate (CAGR) of 6.2% from 2024 to 2031. Physical vapor deposition (PVD) is a vacuum deposition process used to produce thin films and coatings. It relies on the condensation of a vaporized form of the desired film material onto a solid surface within a vacuum chamber. PVD methods are commonly employed for thin film deposition in microelectronics, data storage, and packaging and solar/renewable energy applications due to their ability to precisely control film composition, thickness, and uniformity. Going forward, rising demand from these end use industries is expected to drive the physical vapor deposition market growth over the forecast period.

 Market Dynamics:

The physical vapor deposition market is witnessing strong growth driven by several factors. Growing demand for optical coatings from various industry verticals such as solar, architectural and automotive is propelling the market. Increasing worldwide sales of consumer electronics that require PVD coated components is another major driver. However, issues regarding equipment costs and complex manufacturing processes have been restricting broader market adoption. On the upside, innovations towards advanced PVD techniques that allow higher throughput and film uniformity are opening new opportunities. Miniaturization trends in semiconductor and microelectronics industries also present a key growth avenue.

 Key Features of the Study:

• This report provides an in-depth analysis of the global physical vapor deposition market, and provides market size (US$ Bn) and compound annual growth rate (CAGR%) for the forecast period (2024–2031), considering 2023 as the base year
• It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
• This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
• It profiles key players in the global physical vapor deposition market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies
• Key companies covered as a part of this study include Oerlikon Balzers (Oerlikon Group), IHI Corporation, Silfex Inc., Lam Research Corp, Singulus Technologies AG, Applied Materials, Inc., ULVAC Inc., Veeco Instruments Inc., Buhler AG, Semicore Equipment, Inc., Platit AG., Intevac, Inc., Denton Vacuum, Impact Coatings AB, Advanced Coating Service, KOLZER SRL, Inorcoat, Lafer S.p.A., Kobe Steel Ltd., and HEF Groupe
• Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
• The global physical vapor deposition market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts

Market Segmentation

• By Type:
  • Thermal Evaporation
  • Sputter Deposition
  • Arc Vapor Deposition
• By Application:
  • Microelectronics
  • Storage
  • Solar
  • Medical Equipment
  • Cutting Tools
  • Others
• By Regional:
  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East & Africa
• Company Profiles:
  • Oerlikon Balzers (Oerlikon Group)
  • IHI Corporation
  • Silfex Inc.
  • Lam Research Corp
  • Singulus Technologies AG
  • Applied Materials, Inc.
  • ULVAC Inc.
  • Veeco Instruments Inc.
  • Buhler AG
  • Semicore Equipment, Inc.
  • Platit AG.
  • Intevac, Inc.
  • Denton Vacuum
  • Impact Coatings AB
  • Advanced Coating Service
  • KOLZER SRL
  • Inorcoat
  • Lafer S.p.A.
  • Kobe Steel Ltd.
  • HEF Groupe