all report title image

Failure Analysis Equipment Market, By equipment (Scanning electron microscope (SEM), Transmission electron microscope (TEM), Focused Ion Beam system (FIB), and Dual - Beam (FIB/SEM) systems), By technology (Focused ion beam (FIB), Broad ion milling (BIM), Secondary ion mass spectroscopy (SIMS), Energy dispersive X-ray spectroscopy (EDX), Reactive ion etching (RIE), and Chemical mechanical planarization (CMP)), By end-use (Semiconductors manufacturing, Fiber optics, Bio-medical and life sciences, Metallurgy, Nanotechnology and nanomaterial’s, and Polymers), By Region (North America, Latin America, Europe, APAC, RoW) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030

Ingographics Image

Failure analysis is the approach taken to determine how and why equipment or a component is not working in the desired manner. Some of the common causes include assembly error, misuse, fastener failure, inadequate maintenance, manufacturing defects, low-quality material, improper heat treatments, unforeseen operating conditions, design errors, insufficient quality assurance, inadequate environmental protection, and casting discontinuities. Failure analysis equipment finds applications in a number of end-use segments namely semiconductors manufacturing, fiber optics, bio-medical and life sciences, polymers, metallurgy and nanotechnology, and nanomaterials.

The Global Failure Analysis Equipment Market was valued at US$ 8,388.9 Mn in 2021.

Market Dynamics

The adoption of failure analysis equipment is expected to increase over the forecast period owing to increase in its demand in the electronics and semiconductor industry. In the recent past, increase in demand of nanoelectronics, quantum dots, miniature transistor chips is driving the failure analysis equipment market growth in the electronics and semiconductor industry. Furthermore, electronics and semiconductor market is rapidly growing. For instance, according to Coherent Market Insights global semiconductor industry is expected to reach 732.4 Billion by 2026. Thus rapidly growing semiconductor industry is expected positively impact the growth of global failure analysis equipment market.

Failure analysis equipment offer effective way to increase production efficiency by pin pointing errors in the manufacturing process. However, implementation of this system is expensive and requires high initial investment. System operators need to provide adequate training and knowledge regarding the equipment, which is time and money consuming.

Key features of the study:

  • This report provides an in-depth analysis of the global failure analysis equipment market and provides market size (US$ Million) and compound annual growth rate (CAGR %) for the forecast period (2022-2030), considering 2021 as the base year
  • It elucidates potential revenue opportunities across different segments and explains an attractive investment proposition matrix for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, regional outlook, and competitive strategy adopted by leading players
  • It profiles leading players in the global failure analysis equipment market based on the following parameters – regulatory landscape, company overview, financial performance, product portfolio, geographical presence, distribution strategies, key developments and strategies, and future plans
  • Key companies covered in the global failure analysis equipment market are Carl Zeiss SMT GmbH, JEOL, Ltd., FEI Company, Veeco Instruments, Hitachi High-Technologies Europe GmbH, TESCAN OSRAY HOLDING, A&D Company, Ltd., Oxford Instruments, Bruker, and Eurofins Scientific.
  • The market players are focusing on strategic collaborations to innovate and launch new products to meet the increasing needs and requirements of consumers.
  • Insights from this report would allow marketers and management authorities of companies to make an informed decisions regarding future product launches, technology up gradation, market expansion, and marketing tactics
  • The global failure analysis equipment market report caters to various stakeholders in this industry including investors, suppliers, distributors, new entrants, and financial analysts
  • Stakeholders would have ease in decision-making through the various strategy matrices used in analyzing the global failure analysis equipment market.

Detailed Segmentation

  • Global Failure Analysis Equipment Market, By Product Type:
    • Scanning electron microscope (SEM)
    • Transmission electron microscope (TEM)
    • Focused Ion Beam system (FIB)
    • Dual - Beam (FIB/SEM) systems
  • Global Failure Analysis Equipment Market, By Function:
    • Focused ion beam (FIB)
    • Broad ion milling (BIM)
    • Secondary ion mass spectroscopy (SIMS)
    • Energy dispersive X-ray spectroscopy (EDX)
    • Reactive ion etching (RIE)
    • Chemical mechanical planarization (CMP)
  • Global Failure Analysis Equipment Market, By End Use:
    • Semiconductors Manufacturing
    • Fiber optics
    • Bio-medical and life sciences
    • Metallurgy
    • Nanotechnology and nanomaterials
    • Polymers
  • Global Failure Analysis Equipment Market, By Region:
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East and Africa
  • Company Profiles
    • Carl Zeiss SMT GmbH*
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments
    • JEOL, Ltd.
    • FEI Company
    • Veeco Instruments
    • Hitachi High-Technologies Europe GmbH
    • Tescan Osray Holding
    • A&D Company, Ltd.
    • Oxford Instruments
    • Bruker
    • Eurofins Scientific.

Detailed Segmentation

  • Global Failure Analysis Equipment Market, By Product Type:
    • Scanning electron microscope (SEM)
    • Transmission electron microscope (TEM)
    • Focused Ion Beam system (FIB)
    • Dual - Beam (FIB/SEM) systems
  • Global Failure Analysis Equipment Market, By Function:
    • Focused ion beam (FIB)
    • Broad ion milling (BIM)
    • Secondary ion mass spectroscopy (SIMS)
    • Energy dispersive X-ray spectroscopy (EDX)
    • Reactive ion etching (RIE)
    • Chemical mechanical planarization (CMP)
  • Global Failure Analysis Equipment Market, By End Use:
    • Semiconductors Manufacturing
    • Fiber optics
    • Bio-medical and life sciences
    • Metallurgy
    • Nanotechnology and nanomaterials
    • Polymers
  • Global Failure Analysis Equipment Market, By Region:
    • North America
      • By Equipment:
        • Scanning electron microscope (SEM)
        • Transmission electron microscope (TEM)
        • Focused Ion Beam system (FIB)
        • Dual - Beam (FIB/SEM) systems
      • By Technology:
        • Focused ion beam (FIB)
        • Broad ion milling (BIM)
        • Secondary ion mass spectroscopy (SIMS)
        • Energy dispersive X-ray spectroscopy (EDX)
        • Reactive ion etching (RIE)
        • Chemical mechanical planarization (CMP)
      • By End-Use:
        • Semiconductors Manufacturing
        • Fiber optics
        • Bio-medical and life sciences
        • Metallurgy
        • Nanotechnology and nanomaterials
        • Polymers
      • By Country:
        • U.S.
        • Canada
    • Europe
      • By Equipment:
        • Scanning electron microscope (SEM)
        • Transmission electron microscope (TEM)
        • Focused Ion Beam system (FIB)
        • Dual - Beam (FIB/SEM) systems
      • By Technology:
        • Focused ion beam (FIB)
        • Broad ion milling (BIM)
        • Secondary ion mass spectroscopy (SIMS)
        • Energy dispersive X-ray spectroscopy (EDX)
        • Reactive ion etching (RIE)
        • Chemical mechanical planarization (CMP)
      • By End-Use:
        • Semiconductors Manufacturing
        • Fiber optics
        • Bio-medical and life sciences
        • Metallurgy
        • Nanotechnology and nanomaterials
        • Polymers
      • By Country:
        • Germany
        • Italy
        • U.K.
        • France
        • Russia
        • Rest of Europe
    • Asia Pacific
      • By Equipment:
        • Scanning electron microscope (SEM)
        • Transmission electron microscope (TEM)
        • Focused Ion Beam system (FIB)
        • Dual - Beam (FIB/SEM) systems
      • By Technology:
        • Focused ion beam (FIB)
        • Broad ion milling (BIM)
        • Secondary ion mass spectroscopy (SIMS)
        • Energy dispersive X-ray spectroscopy (EDX)
        • Reactive ion etching (RIE)
        • Chemical mechanical planarization (CMP)
      • By End-Use:
        • Semiconductors Manufacturing
        • Fiber optics
        • Bio-medical and life sciences
        • Metallurgy
        • Nanotechnology and nanomaterials
        • Polymers
      • By Country:
        • China
        • India
        • Japan
        • Australia
        • South Korea
        • ASEAN
        • Rest of Asia Pacific
    • Latin America
      • By Equipment:
        • Scanning electron microscope (SEM)
        • Transmission electron microscope (TEM)
        • Focused Ion Beam system (FIB)
        • Dual - Beam (FIB/SEM) systems
      • By Technology:
        • Focused ion beam (FIB)
        • Broad ion milling (BIM)
        • Secondary ion mass spectroscopy (SIMS)
        • Energy dispersive X-ray spectroscopy (EDX)
        • Reactive ion etching (RIE)
        • Chemical mechanical planarization (CMP)
      • By End-Use:
        • Semiconductors Manufacturing
        • Fiber optics
        • Bio-medical and life sciences
        • Metallurgy
        • Nanotechnology and nanomaterials
        • Polymers
      • By Country:
        • Brazil
        • Mexico
        • Argentina
        • Rest of Latin America
    • Middle East and Africa
      • By Equipment:
        • Scanning electron microscope (SEM)
        • Transmission electron microscope (TEM)
        • Focused Ion Beam system (FIB)
        • Dual - Beam (FIB/SEM) systems
      • By Technology:
        • Focused ion beam (FIB)
        • Broad ion milling (BIM)
        • Secondary ion mass spectroscopy (SIMS)
        • Energy dispersive X-ray spectroscopy (EDX)
        • Reactive ion etching (RIE)
        • Chemical mechanical planarization (CMP)
      • By End-Use:
        • Semiconductors Manufacturing
        • Fiber optics
        • Bio-medical and life sciences
        • Metallurgy
        • Nanotechnology and nanomaterials
        • Polymers
      • By Country/Region:
        • GCC Countries
        • South Africa
        • Rest of Middle East and Africa
  • Need a Custom Report?

    We can customize every report - free of charge - including purchasing stand-alone sections or country-level reports

    Customize Now
Logo

Credibility and Certifications

ESOMAR
DUNS Registered

860519526

Clutch
Credibility and Certification
Credibility and Certification

9001:2015

Credibility and Certification

27001:2022

EXISTING CLIENTELE

Joining thousands of companies around the world committed to making the Excellent Business Solutions.

View All Our Clients
trusted clients logo
© 2024 Coherent Market Insights Pvt Ltd. All Rights Reserved.