Extreme Ultraviolet (EUV) Lithography Market
Extreme ultraviolet (EUV) lithography is an advanced semiconductor manufacturing technology that uses short wavelength light sources in the EUV region of the electromagnetic spectrum for integrated circuit fabrication. It employs a radiation wavelength of approximately 13.5 nm to pattern microscopic integrated circuits on silicon wafers. Compared to optical lithography which uses shorter ultraviolet wavelengths around 193 nm, EUV lithography offers potential improved resolution required to print smaller nodes. As chip designs continue to shrink and transistor channels measure in the tens of nanometers, EUV lithography provides a viable complimentary technology to enable continued Moore's law. With significant R&D investments by companies and research consortiums, EUV lithography has been commercially deployed for high volume manufacturing.
Market Dynamics:
Global extreme ultraviolet (EUV) lithography market growth is driven by several factors such as ongoing miniaturization of semiconductor devices requiring advanced lithography techniques for chip fabrication. EUV lithography allows manufacturing of integrated circuits with feature sizes below 10 nm, meeting the resolution demands of next generation nodes. Growing investments by semiconductor manufacturers in expanding wafer capacities and upgrading fabrication facilities boosts adoption of EUV lithography equipment. However, high costs associated with EUV lithography tools and complex power source requirements can hamper the market growth. Further, recent global shortage of components like neon gas restricts complete shift to EUV technology. Increasing R&D to improve efficiency and resolution as well as expanding photomask infrastructure present new opportunities in the future.
Key features of the study:
- This report provides in-depth analysis of the global extreme ultraviolet (EUV) lithography market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2024–2031), considering 2023 as the base year
- It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
- This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players.
- It profiles key players in the global extreme ultraviolet (EUV) lithography market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies.
- Key companies covered as a part of this study include ASML Holding N.V., Nikon Corporation, Canon Inc., Intel Corporation, Samsung Electronics Co., Ltd., TSMC (Taiwan Semiconductor Manufacturing Company), GlobalFoundries, Micron Technology, Inc., Applied Materials, Inc., Lam Research Corporation, KLA Corporation, Tokyo Electron Limited, Advantest Corporation, Hitachi High-Technologies Corporation, and Teradyne, Inc.
- Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics.
- Global extreme ultraviolet (EUV) lithography market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
- Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global extreme ultraviolet (EUV) lithography market
Detailed Segmentation-
Table of Contents
*Browse 60 market data tables and 40 figures on "Extreme Ultraviolet (EUV) Lithography Market - Global forecast to 2031”
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