Electrically conductive adhesives are an alternative to soldering and can be used in a variety of electronic applications that require mechanical bonding of components or a substrate. They are especially useful for applications where the substrate is temperature sensitive, such as touch-panels, LCD displays, coating and bonding RFID chips, and mounting LEDs. They are also used in solar cells, as they have a much lower heat output than solder and are less likely to damage sensitive wafers.

Market Dynamics:

Growing demand from electronic industry is a prime factor driving growth of the global electrically conductive adhesives market. Electrically conductive adhesives are used to make electrical contacts on PCBs and die attach and can be found in many other electronic applications where the substrate or die is temperature sensitive such as touch-panels, LCD displays, bonding RFID chips, and mounting LEDs. Additionally, increasing penetration of electric vehicle is again projected to augment market growth.

On the other hand, negative impact of Covid-19 and fluctuating price of raw materials is expected to hamper the market growth.

Key features of the study:

• This report provides in-depth analysis of the global electrically conductive adhesives market, and provides market size (US$ Million) and compound annual growth rate (CAGR%) for the forecast period (2023–2030), considering 2022 as the base year
• It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
• This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends,  regional outlook, and competitive strategies adopted by key players
• It profiles key players in the global electrically conductive adhesives market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies
• Key companies covered as a part of this study include 3M, Aremco, Creative Materials Inc., Dow, H.B. Fuller Company, Henkel AG & Co. KGaA, HITEK Electronic Materials Ltd, Master Bond Inc., MG Chemicals, Panacol-Elosol GmbH, Parker Hannifin Corp., Permabond LLC, and Bostik
• Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
• The global electrically conductive adhesives market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
• Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global electrically conductive adhesives market

Detailed Segmentation:

• Global Electrically Conductive Adhesives Market, Chemistry Type
  • Epoxy
  • Silicone
  • Polyurethane
  • Acrylic
  • Other Chemistry Types
  • TYPE
  • Isotropic
  • Anisotropic
• Global Electrically Conductive Adhesives Market, By Application
  • Solar Cells
  • Automotive Electronics
  • LED Lightning
  • Printing Circuit Board
  • LCD Displays
  • Other Applications
• Global Electrically Conductive Adhesives Market, By Geography
  • North America
  • Europe
  • Asia-Pacific
  • Latin America
  • Middle East & Africa
• Company Profiles
  • 3M
  • Aremco
  • Creative Materials Inc.
  • Dow
  • H.B. Fuller Company
  • Henkel AG & Co. KGaA
  • HITEK Electronic Materials Ltd
  • Master Bond Inc.
  • MG Chemicals
  • Panacol-Elosol GmbH
  • Parker Hannifin Corp.
  • Permabond LLC
  • Bostik