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INTELLIGENT POWER MODULE MARKET SIZE AND SHARE ANALYSIS - GROWTH TRENDS AND FORECASTS (2024-2031)

Intelligent Power Module Market, By Power Device (IGBT and MOSFET), By Voltage Rating (0 V to 599 V, 600 V to 1,199 V, and 1,200 V and above), By Application (Automotive, Industrial, Consumer Electronics, Energy & Utility, IT & Telecommunication, and Others), By Geography (North America, Latin America, Asia Pacific, Europe, Middle East, and Africa)

  • Published In : Jul 2024
  • Code : CMI7101
  • Pages :172
  • Formats :
      Excel and PDF
  • Industry : Semiconductors

Key Developments

  • In August 2023, Fuji Electric Co., Ltd., a Japanese electrical equipment company, manufacturing pressure transmitters, flowmeters, gas analyzers, controllers, inverters, pumps, generators, ICs, motors, and power equipment announced the launch of the P633C Series, a new generation of compact intelligent power modules. These modules are designed to optimize the power consumption of devices like machine tools and home appliances that they are integrated into, helping to improve the energy efficiency of these applications.
  • In July 2023, onsemi, a leading provider of intelligent power and sensing technologies, and Magna, a prominent mobility technology company, announced a long-term supply agreement. Under this agreement, Magna will integrate onsemi's EliteSiC intelligent power solutions into its eDrive systems.
  • In May 2022, Sensitron, designed a non-hermetic 40V, 30A radiation tolerant DC load switch module with 100mV/A output current telemetry announced the SPG025N035P1B, a GaN Half Bridge Intelligent Power Module (IPM) that utilizes Efficient Power Conversion's 350 V EPC2050 eGaN FET. By replacing traditional silicon FETs with EPC's 350 V and EPC2050 GaN FETs, Sensitron was able to reduce the size of their solution by 60% while also improving the module's exceptional junction-to-case thermal conduction.
  • In February 2022, Infineon Technologies is bolstering its market leadership in power semiconductors by substantially expanding its manufacturing capacity for wide bandgap (SiC and GaN) technologies. The company is investing over US$ 2 billion to build a third module at its Kulim, Malaysia facility. Once this new module reaches full production, it is anticipated to generate an additional US$ 2 billion in annual revenue through the manufacturing of silicon carbide and gallium nitride products.
  • In April 2021, Cissoid announced the expansion of its 3-Phase Silicon Carbide (SiC) MOSFET Intelligent Power Module (IPM) product line. The company introduced new liquid-cooled modules specifically designed for e-mobility applications.
  • In December 2020, Infineon Technologies AG, designs, develops, manufactures, and markets application-specific ICs introduced the CIPOS Maxi IPM IM828 series, the industry's first 1,200 V transfer-molded silicon carbide (SiC) integrated power module (IPM). This compact inverter solution offers excellent thermal management and a wide range of switching speeds, making it well-suited for three-phase AC motors and permanent magnet motors in variable speed drive applications.

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