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Market Driver: Growing Miniaturization of Electronic DevicesRapid advancements in semiconductor technology and wireless communication standards have led to relentless miniaturization of electronic components in past few decades. Consumer gadgets like smartphones and wearables are now packed with myriad sensors, chips, antennas and other miniature modules. While this allows unprecedented functionality in small form factors, assembly of these heavily packed printed circuit boards is challenging using conventional methods. In mold electronics addresses this problem by integrating electronic modules directly into device casings and structures during injection molding process.
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