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Adoption of Artificial Intelligence and Edge ComputingThe rise of Artificial Intelligence (AI), Internet of Things (IoT), 5G networks, and edge computing is propelling the need for more powerful data center infrastructure located closer to the end users. Processing huge volumes of data generated at the edge using AI and IoT sensors requires cutting edge servers with high performance GPUs and CPUs. However, these dense systems dissipate significantly higher heat loads which needs to be removed quickly to prevent thermal throttling. Traditional air cooling designs struggle to keep pace with thermal requirements of such advanced edge data centers. Also, with edge facilities being deployed in various environmental conditions at customer premises and cell towers, cooling systems must be resilient enough to function reliably without disruptions. Leading AI technology companies have started investing in direct-to-chip immersion cooling that provides up to 10 times higher cooling density for their AI training clusters compared to air. Major telecom operators and cloud giants are also deploying hybrid cooling solutions combining liquid cooling with outdoor economizers to handle heat loads at their micro data center pods located at cell sites. Rising adoption of AI, IoT, and edge services will compel more data center operators to implement next-gen liquid cooling methods for reliable thermal management of their future.
For instance, in April 2023, Meta announced changes to its liquid cooling techniques for AI-centric data center design, focusing on optimizing new facility usage to better support artificial intelligence.
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