CONSUMER ELECTRONICS PACKAGING MARKET SIZE AND SHARE ANALYSIS - GROWTH TRENDS AND FORECASTS (2024-2031)
Consumer Electronics Packaging Market, By Material Type (Plastic, Metal, Paper and Paperboard, and Foam Packaging), By Product Type (Corrugated Boxes, Paperboard Boxes, Thermoformed Trays, Blister Packs and Clamshells, and Others), By Geography (North America, Europe, Asia Pacific, Latin America, Middle East and Africa).
In June 2022, Digimarc Corporation revealed a collaboration with Sealed Air, a prominent player in digital printing and packaging. Together, they aim to introduce widespread product digitization in areas like e-commerce, industrial, and consumer goods through smart packaging solutions.
In March 2022, Intel unveiled its initial plans to invest up to USD 84 billion in the European Union over the next 10 years. This investment will cover various aspects of the semiconductor process including research and development, production, and advanced packaging technologies.
In February 2022, Siemens Digital Industries Software revealed its collaboration with Advanced Semiconductor Engineering (ASE), a prominent supplier of semiconductor packaging. Together, they are developing two platforms designed to handle the assembly and connections of various intricate integrated circuits (IC).
In January 2022, Smurfit Kappa Group shared plans to invest USD 33 million in expanding its operations in Brazil. The investment aims to increase the company's ability to produce packaging for home appliances, fresh produce, and pharmaceutical products that are convenient for store shelves.