The limitations of employing conventional slicing machines, such as the high volume of wafer waste during cutting, the slow speed of slicing, and the poor quality of dice, are one of the main factors contributing to the market's growth. To address the issues with conventional machinery, these factors are pushing manufacturers to create cutting-edge wafer slicing equipment. The "DW288" diamond wire wafer slicing machine, for instance, was introduced by Meyer Burger in July 2017. This machine guarantees maximum material utilization during cutting, uses little electricity during production, and doesn't produce any slurry, which is made of polyethylenglycol (PEG) and silicon carbide (SiC). This machine also helps to lessen the difficulties related to the recycling of silicon wafer. Additionally, the need for small size chips to be used in electronic devices is being further fueled by their shrinking, which is also fueling demand for diamond wire wafer slicing machines internationally. This is because these machines, in comparison to conventional slicer machines, are more accurate at cutting a wafer into smaller sizes. One major trend that is being seen in the market is the rising utilization of large-sized wafers. For instance, a 2014 news release from SEMI, a major semiconductor manufacturing business, stated that companies like Samsung, Intel, and IBM, among others, who previously used wafers with a diameter of 300 mm, are now converting to wafers with a diameter of 450 mm.
Coherent Market Insights projects that the Diamond Wire Wafer Slicing Machine Market was valued at US$ 1.09 billion in 2021, and it is anticipated that during the forecast period, US$ 2.34 billion will be generated, with a growth rate of 10.05 percent.
Major Players in the Diamond Wire Wafer Slicing Machine Industry:
1. Meyer Burger Technology AG
The company was started in 1953 and is based in Gwatt, Thun, Switzerland. Solar energy equipment is produced by Meyer Burger Technology AG. The business produces solar modules and high-performance solar cells. Meyer Burger formed new agreements in December 2022 to further the creation of perovskite-based, high-performance solar panels.
2. Slicing Tech
The company was started in 2010 and is located in San Mateo, California, United States. Services for e-commerce are offered by Slice Technologies Inc. The business keeps online receipts together with data on user purchases, shipping, and spending. Businesses that demand high volume, high precision wafer slicing are served by SlicingTech.
3. Diamond Wire Technology
The business was founded in 2009 and is based in Colorado, United States. The semiconductor and photovoltaic sectors can choose from a variety of wire, cutting fluids, and cutting beams thanks to Diamond Wire Material Technologies. The company creates, manufactures, and markets diamond wire saws, in addition to diamond wires and accessories, on a global scale.
4. Disco Corporation
The firm was founded in 1937 and is based in Tokyo, Japan. The business makes abrasive and accurate industrial machines for grinding and cutting operations. The company's products are used in the semiconductor, electronics, and building sectors to create consumer goods such personal computers, digital cameras, video game consoles, and digital video disc (DVD) players.
5. Plasma Therm LLC,
The company was founded in 1974 and is based in Florida, United States. Plasma-Therm, LLC develops plasma etch, deposition, and singulation instruments in addition to producing cutting-edge plasma processing equipment. Markets for semiconductors and nanotechnology are served by Plasma-Therm.
6. Tokyo Electron Ltd
The company was started in 1963 and is located in Minato City, Tokyo, Japan. The business produces and markets industrial electronics goods such photovoltaic (PV) production equipment, flat panel display (FPD) manufacturing equipment, semiconductor manufacturing equipment, and electronic components. Tokyo Electron unveiled TactrasTM-UDEMAETM, the Etch System for 300mm Power Devices, in 2021.
7. EV Group
The company was started in 1980 and is based in St Florian, Austria. For the production of semiconductors, MEMS, and other electronic devices, the EV Group (EVG) is a major provider of machinery and process solutions. A complex global network of clients and partners is supported and serviced by EV Group.
*Definition: A high-speed spindle fitted with a diamond blade is used in a diamond wire wafer slicing machine to slice silicon wafer. The equipment that separates these wafers into individual chips has a dicing saw.
